LEADER 00000cam a2200829 a 4500 001 162589653 003 OCoLC 005 20240129213017.0 006 m o d 007 cr cn||||||||| 008 070806s1999 enka ob 001 0 eng d 019 182729028|a648331333|a758464551|a824151996|a1035656419 |a1113467671|a1159633958|a1202553811|a1240523287 020 9780750635455 020 0750635452 020 9780080517346|q(electronic bk.) 020 008051734X|q(electronic bk.) 020 128107134X 020 9781281071347 020 9786611071349 020 6611071342 029 1 AU@|b000050415547 029 1 AU@|b000067075263 029 1 AU@|b000067101938 029 1 CHNEW|b001006736 029 1 DEBBG|bBV039831034 029 1 DEBBG|bBV041119757 029 1 DEBBG|bBV042315879 029 1 DEBSZ|b396676405 029 1 DEBSZ|b405310889 029 1 GBVCP|b785365559 029 1 NZ1|b12435198 035 (OCoLC)162589653|z(OCoLC)182729028|z(OCoLC)648331333 |z(OCoLC)758464551|z(OCoLC)824151996|z(OCoLC)1035656419 |z(OCoLC)1113467671|z(OCoLC)1159633958|z(OCoLC)1202553811 |z(OCoLC)1240523287 037 95445:95444|bElsevier Science & Technology|nhttp:// www.sciencedirect.com 040 OPELS|beng|epn|cOPELS|dOCLCQ|dN$T|dYDXCP|dIDEBK|dE7B |dKNOVL|dOCLCQ|dOCLCO|dOCLCQ|dUMI|dKNOVL|dDEBSZ|dOCLCO |dKNOVL|dOCLCQ|dOCLCO|dOCLCF|dOCLCO|dOCLCQ|dOCLCO|dOCLCQ |dOCLCO|dCOO|dOCLCO|dOCLCQ|dOCLCO|dOCLCQ|dOCLCO|dSTF|dD6H |dOCLCO|dCEF|dOCLCQ|dLEAUB|dOCLCO|dUKBTH|dLUN|dVT2|dOCLCQ |dCOM|dOCLCO|dOCLCQ|dOCLCO 049 INap 082 04 621.3815/31 082 04 621.3815/31|222 099 eBook O’Reilly for Public Libraries 100 1 Judd, Mike. 245 10 Soldering in electronics assembly /|cMike Judd and Keith Brindley.|h[O'Reilly electronic resource] 250 2nd ed. 260 Oxford ;|aBoston :|bNewnes,|c1999. 300 1 online resource (xi, 369 pages) :|billustrations 336 text|btxt|2rdacontent 337 computer|bc|2rdamedia 338 online resource|bcr|2rdacarrier 504 Includes bibliographical references (pages 313-316) and index. 505 0 Soldering process; Electronics assemblies; Solder; Flux; CS soldering processes; SC soldering processes; BGA technology; Cleaning of soldered assemblies; Avoiding problems -- soldering quality; Standards and specifications; Glossary; References; Worldwide addresses; Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines; Index. 520 Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline. Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment. 546 English. 588 0 Print version record. 590 O'Reilly|bO'Reilly Online Learning: Academic/Public Library Edition 650 0 Printed circuits|xDesign and construction. 650 0 Solder and soldering. 650 6 Soudure. 650 7 solder.|2aat 650 7 Printed circuits|xDesign and construction|2fast 650 7 Solder and soldering|2fast 650 7 Elektronisches Bauelement|2gnd 650 7 Löten|2gnd 700 1 Brindley, Keith. 740 0 Electronics assembly. 776 08 |iPrint version:|aJudd, Mike.|tSoldering in electronics assembly.|b2nd ed.|dOxford ; Boston : Newnes, 1999 |z0750635452|z9780750635455|w(DLC) 99224069 |w(OCoLC)42934451 856 40 |uhttps://ezproxy.naperville-lib.org/login?url=https:// learning.oreilly.com/library/view/~/9780750635455/?ar |zAvailable on O'Reilly for Public Libraries 938 ebrary|bEBRY|nebr10206086 938 EBSCOhost|bEBSC|n211511 938 YBP Library Services|bYANK|n2737450 994 92|bJFN